HONOR’s latest flagship device, the HONOR Magic V2, redefines the benchmark for folding smartphones while prioritizing the essentials of a top-tier slate phone. The ultra-slim device is crafted to offer unparalleled functionality and a sleek, sophisticated design that is unrivaled in the market.
Market research shows the svelte form factor of a digital device takes center stage as the core selection criterion of consumers. In pursuit of ultimate portability, HONOR has meticulously refined the product structure, manufacturing process, and material selection for its latest flagship, the HONOR Magic V2. This exemplary device provides users with a lightweight and slim form factor, expertly addressing key challenges and setting a new standard in mobile innovation.
HONOR Super-light Titanium Hinge: A Groundbreaking First in the Industry Materials
New materials
For the first time, HONOR has utilized titanium alloy in the hinge cover, an aerospace-grade material and a pioneering innovation in the hinge design of foldable smartphone industry. Titanium possesses the ideal balance between weight and strength, being lighter than aluminum and stronger than steel. It is a material that embodies the trifecta of ultra-lightness, ultra-toughness, and ultra-corrosion-resistance, making it the perfect alloy for a plethora of applications.
HONOR’s proprietary micro lock, applied to the hinge components’ connections, represents a breakthrough in craftsmanship. The fusion of ultra-precise manufacturing techniques and robust materials effectively mitigates fold marks resulting from screen misalignments. Additionally, the custom high-precision nuts – the industry’s most accurate and compact nuts (0.75 x φ2.9mm) – offer a one-of-a-kind fastening solution for securing hinge components. This innovative fastening structure outperforms conventional nuts, optimizing space utilization within the device.
HONOR Ultra-thin Bionic VC Cooling System
Smartphones, particularly those with powerful processors and advanced features, require effective cooling systems to prevent overheating, maintain optimal performance, and ensure long-term durability. The HONOR Ultra-thin Bionic VC Cooling System addresses these needs by employing a multi-layer approach, the cooling system incorporates advanced materials such as ultra-thin vapor chamber (VC), ultra-high thermal conductivity graphite, thermal conductivity gel, copper foil, and high thermal conductivity AL middle frame. Despite the constraints of ultra-thin device thickness, this innovative HONOR Ultra-thin Bionic VC cooling system maximizes every inch to deliver exceptional efficiency in cooling.
